The 007-MXQ-01 is a liquid cooled cold plate specifically designed for 3 IGBT power modules measuring 108x62mm in a compact and lightweight design. The advanced design of the 007-MXQ-01 allows for efficient heat transfer between the cold plate contact area and the IGBT power module base plate.
The 007-MXQ-01 can dissipate 3000 Watts of heat at a flow rate of 8 LPM. This results in a 24°C temperature rise from the fluid inlet to the maximum cold plate temperature. The internal fin structure also results in a pressure loss of 1.16 PSI at this flow rate. This performance is achieved with an empty weight of the coldplate of less than 1.2 kg.
Part # | Coldplate Dimensions | Material | Inlet/Outlet Ports |
007-MXQ-01 | 202 mm x 130 mm x 20 mm | Aluminum | ¼ – 18 NPT |
The 007-MXQ-01 Liquid Cooled Coldplate is specifically designed to accept mounting of three(3) of these IGBT power module packages;
SEMIKRON SEMiTRANS® Case D56
INFINEON 62mm Package
FUJI SEMICONDUCTOR M127, M234 and M235 Packages
POWEREX 62mm Package
All mounting holes are predrilled, tapped, and ready to accept the required mounting screws. These coldplates are designed to be “off the self” to help the power electronics engineer to focus on their drive design.
The performance curve shown here is for a cooling fluid of 50% water and 50% ethylene glycol, a very common mixture for the cooling of IGBT power modules when using aluminum coldplates.
Thermal Resistance values use the difference between the Maximum Coldplate Temperature and the Fluid Inlet Temperature.
The pressure drop does include ¼- 18 NPT hose barb fittings.
These aluminum coldplates are compatible with the following cooling fluids;