Thermal Management Services

DESIGN

MaxQ Technology uses the most advanced 3D and computational fluid dynamic (CFD) software tools to design the coldplate products you need. We simulate and predict the thermal and pressure performance of our coldplate products to within a five percent (5%) margin of error. Our customers are confident in our ability to produce exactly what they need.

FABRICATION

MaxQ Technology offers a variety of fabrication options and provides expertise in both CNC machining and metal joining. Our engineers work closely with our customers to determine the most effective fabrication process that will be the optimal solution for your needs. We are proud to provide initial prototype units in the shortest possible timeframe.

TESTING

No product design is complete at MaxQ Technology until it has been thoroughly tested to ensure product quality and to validate that the product meets it’s required performance specification. MaxQ Technology has the in-house testing capability to measure both thermal resistance and pressure drop performance for all cooling and coldplate products.

MaxQ Design

Design for Thermal Management

For years, the principals at MaxQ Technology have used advanced 3D and Computational Fluid Dynamic (CFD) Software tools to accurately design, simulate and predict, to within a 5% error margin, the thermal and pressure performance of their coldplate products. This capability has resulted in dozens of “first time success” products and has instilled strong customer confidence.

Design Services Include

  • Thermal, electro-thermal, and thermo-mechanical simulation
  • Power circuit electrical and inductance simulation
  • Module power loss measurements
  • Coldplate thermal performance measurements
  • Coldplate pressure loss measurements

Electronic Packaging

Our Capabilities Include

  • Liquid-cooled coldplate design
  • Power electronic packaging and integration from module, cooling system, up to system drive components
  • Chip layout design using MOSFETs, IGBTs, rectifiers, and free-wheeling diodes
  • Substrate layout design using direct bond copper (DBC) substrates, insulated metal substrates (IMS) and FR4 boards
  • Quad-Flat No-Leads (QFN), Chip Scale Packaging (CSP), and flip-chip packaging

MaxQ Technology has created effective electronic packaging designs for such products as:

Power IGBT and MOSFET Modules (single, dual, or six-pack):

0.5KW to 200KW power converters, electronic power steering modules, advanced power device cooling structures, and composite materials such as AlSiC, Cu-C and Al-Diamond.

Sensor Modules

including pressure, accelerometer, and airflow. Our team is prepared to handle difficult design problems related to micro-electro-mechanical systems (MEMS) products.

Microelectronics

Quad-Flat No-Leads (QFN), Chip Scale Packaging (CSP), and other surface mount products. Flip-chip packaging for highly integrated and cost sensitive designs for high volume production.

Complete System Level Designs

motor drives, energy storage, and other power conversion units. Our engineers have substantial practical knowledge in mechanical and system integration.

MaxQ Fabrication

MaxQ Technology offers a variety of fabrication options and provides expertise in both CNC machining and metal joining. Our engineers work closely with our customers to determine the most effective fabrication process that will be the optimal solution for your needs. We are proud to provide initial prototype units in the shortest possible timeframe.

MaxQ Technology is known as a pioneer and global leader in applying friction stir welding (FSW) to create efficient heat transfer products. Our innovative Q-CHILL™ process takes advantage of FSW to incorporate high-density fin structures and

low-pressure drop flow geometry. These patented coldplates are designed and, since 2009, manufactured entirely in-house at our Tempe, Arizona, facility.

MaxQ Technology also offers vacuum brazing, and both sintering and diffusion bonding on a variety of wrought, forged, or cast metals.

With so many options, a completely reliable and high-value solution is available for any application. Contact us to learn more.

MaxQ Testing

No product is complete until it has been thoroughly tested to ensure quality and effectiveness. MaxQ Technology has the in-house capability to provide both thermal resistance and pressure drop testing for all of our cooling products.

This high level of testing provides our clients with confidence that their standard or custom cooling products will meet their needs and provide reliable service.

We also provide strong technical support for all our customers on an ongoing basis, so our clients know they can turn to MaxQ Technology with any questions, issues, or newly discovered needs and requirements.

Thank you for your interest in MaxQ Technology.

Connect with us and tell us how we can be of service.