Standard IGBT Module

Q-CHILL™ Coldplates

Available as “off the shelf” products, our standard aluminum Q-CHILL™ coldplates meet standard IGBT power module footprints manufactured by Infineon, Semikron, PowerexMitsubishi Electric, and Fuji Electric. Our coldplates are compatible with standard cooling fluids used in most applications, including etylene glycol and water solutions (EGW), dielectric fluids such as Flourinert™ and oils. Low pressure drops may be achieved with high thermal dissipation.

Q-CHILL™ Standard Coldplates are available in the following models:

 

Part # Coldplate Dimensions Semikron Infineon Fuji Semiconductor Powerex Price
001-MXQ-01 162 mm x 136 mm x 20 mm SKiM® 63  n/a n/a n/a $350
003-MXQ-01 162 mm x 172 mm x 20 mm SKiM® 93  n/a n/a n/a $350
 005-MXQ-01 162 mm x 147 mm x 20 mm SEMiX® 33 EconoPACK™ + M629 Intellimod™ L-Series $350
007-MXQ-01 202 mm x 130 mm x 20 mm SEMiTRANS® Case D56 62mm Package M127, M234 and M235 Packages 62mm Package $350
009-MXQ-01 198 mm x 147 mm x 20 mm SEMiX® 3 EconoDUAL™ 3 Spring Contact Module NX™ Series $350

 

001-MXQ-01

Liquid Cooled Coldplate

High Performance IGBT Module Coldplate

The 001-MXQ-01 is a liquid cooled coldplate specifically designed for cooling a Semikron SKiM® 63 IGBT power module in a compact and lightweight design. The advanced design of the 001-MXQ-01 allows for efficient heat transfer between the coldplate contact area and the IGBT power module base plate.

Coldplate Dimensions

162 mm x 136 mm x 20 mm

Compatible Power Module

Semikron SKiM® 63

003-MXQ-01

Liquid Cooled Coldplate

High Performance IGBT Module Coldplate

The 003-MXQ-01 is a liquid cooled coldplate specifically designed for cooling a Semikron SKiM® 93 IGBT power module in a compact and lightweight design. The advanced design of the 003-MXQ-01 allows for efficient heat transfer between the coldplate contact area and the IGBT power module base plate.

Coldplate Dimensions

162 mm x 172 mm x 20 mm

Compatible Power Module

Semikron SKiM® 93

005-MXQ-01

Liquid Cooled Coldplate

High Performance IGBT Module Coldplate

The 005-MXQ-01 is a liquid cooled coldplate specifically designed for cooling IGBT power modules in a compact and lightweight design. The advanced design of the 005-MXQ-01 allows for efficient heat transfer between the coldplate contact area and the IGBT power module base plate.

Coldplate Dimensions

162 mm x 147 mm x 20 mm

Compatible Power Module

FUJI SEMICONDUTOR M629INFINEON EconoPACK™ +POWEREX Intellimod™ L-SeriesSEMIKRON SEMiX® 33

007-MXQ-01

Liquid Cooled Coldplate

High Performance IGBT Module Coldplate

The 007-MXQ-01 is a liquid cooled cold plate specifically designed for 3 IGBT power modules measuring 108x62mm in a compact and lightweight design. The advanced design of the 007-MXQ-01 allows for efficient heat transfer between the cold plate contact area and the IGBT power module base plate.

Coldplate Dimensions

202 mm x 130 mm x 20 mm

Compatible Power Module

SEMIKRON SEMiTRANS® Case D56INFINEON 62mm PackageFUJI SEMICONDUCTOR M127, M234 and M235 packagesPOWEREX 62mm Package

009-MXQ-01

Liquid Cooled Coldplate

High Performance IGBT Module Coldplate

The 009-MXQ-01 is a liquid cooled coldplate specifically designed for cooling three 122x62mm IGBT power modules in a compact and lightweight design. The advanced design of the 009-MXQ-01 allows for efficient heat transfer between the coldplate contact area and the IGBT power module base plate.

 Coldplate Dimensions

198 mm x 147 mm x 20 mm

Compatible Power Module

SEMIKRON SEMiX® 3INFINEON EconoDUAL™ 3FUJI SEMICONDUCTOR Spring Contact ModulePOWEREX NX™ Series