The 003-MXQ-01 is a liquid cooled coldplate specifically designed for cooling a Semikron SKiM® 93 IGBT power module in a compact and lightweight design. The advanced design of the 003-MXQ-01 allows for efficient heat transfer between the coldplate contact area and the IGBT power module base plate.
The 003-MXQ-01 can dissipate 3000 Watts of heat at a flow rate of 8 LPM. This results in only an 18°C temperature rise from the fluid inlet to the maximum coldplate temperature. The internal fin structure also results in a pressure loss of 1.5 PSI at this flow rate. This performance is achieved with an empty weight of the coldplate of less than 1.3 kg.
162 mm x 172 mm x 20 mm
¼ – 18 NPT
Compatible IGBT Module Package
The 003-MXQ-01 Liquid Cooled Coldplate is specifically designed to accept mounting of a Semikron SKiM® 93 package.
All mounting holes are predrilled, tapped, and ready to accept the required mounting screws. These coldplates are designed to be “off the self” to help the power electronics engineer to focus on their drive design.
Coldplate Mechanical Outline
Overall Dimensions: 162 mm x 172 mm x 20 mm
Fluid Ports: Tapped for ¼-18 NPT
Mounting Surface Flatness: 0.025 / 25.4 mm
Mounting Surface Roughness: 0.8 um Max
Coldplate Performance Curve
The performance curve shown here is for a cooling fluid of 50% water and 50% ethylene glycol, a very common mixture for the cooling of IGBT power modules when using aluminum coldplates.
Thermal Resistance values use the difference between the Maximum Coldplate Temperature and the Fluid Inlet Temperature.
The pressure drop does include ¼- 18 NPT hose barb fittings.
Compatible Cooling Fluids
These aluminum coldplates are compatible with the following cooling fluids;